Research Assistant / Master thesis worker (Advanced electronics packaging) , Tutkimusapulainen/ Dipl

Tampere University and Tampere University of Applied Sciences create a unique environment for multidisciplinary, inspirational and high-impact research and education. Our universities community has its competitive edges in technology, health and society. www.tuni.fi/en

We are looking for a motivated MSc thesis student to join an expert research team working at the intersection of academia and industry. The work is financed by ABB, and supervision will be jointly provided by Tampere University and ABB.

The position is meant for the members of our university community, and the recruitment is only published on internal channels. 

The Master’s thesis project will start as soon as possible and is expected to last approximately six months. The work will be carried out in close collaboration between Tampere University (TAU) and ABB. 

This thesis project is directly linked to the development of the EU-level pilot line SiPFAB, which has received 40 M€ of funding to advance high-power semiconductor device packaging technologies. The selected candidate will contribute to research aiming to push the state of the art in diffusion bonding for GaN-based power components. Further information about SiPFAB, related to collaboration with ABB, can be found here: System-in-a-Package Pilot Line SiPFAB | Tampere universities

Thesis topic and planned theses work

The project focuses on evaluating and developing advanced diffusion bonding approaches for semiconductor chips—especially GaN devices—using pre-metallized AlN carriers. The aim is to understand, optimize, and scale bonding processes for both small and large GaN chips. Planned Thesis Work will include both literature research and hands-on experimental work.

Research & Planning Phase

1. Conduct a comprehensive literature survey on the state-of-the-art diffusion bonding technologies for GaN and related materials.
2. Develop an experimental plan for baseline bonding trials using small GaN chips.
3. Design an experimental plan to optimize bonding for large-area GaN chips.
4. Create a qualification plan for bonded chips, including electrical, mechanical, and thermal performance criteria.
5. Identify suitable sources for test GaN chips and pre-metallized AlN carriers.

Experimental & Characterization Phase

6. Perform bonding experiments with various interface materials and bonding parameters for individual GaN chips.
7. Characterize the bonded samples using mechanical, electrical, and thermal analysis methods to assess bonding quality and identify optimization pathways.

What We Offer

• Work within an experienced team with strong connections to academia and industry.
• Joint supervision by experts at Tampere University and ABB.
• Opportunity to contribute to a major European initiative (SiPFAB) shaping the future of high-power semiconductor packaging.
• Valuable hands-on experience in advanced semiconductor bonding technologies and materials engineering.

The positions will be full-time, and they will be filled for a 6-month fixed-term period, starting asap. The starting date is negotiable and depends on the candidate’s availability and project in question. A trial period applies to all our new employees. 

The salary will be based on both the job demands and the employee’s personal performance in accordance with the University Salary System. The position of Research Assistant is placed on the job demand level 1 (the demand level chart for the teaching and research staff). In addition, employees will receive a performance-based salary which for Research Assistants is based on their study credits. Salary for a Research Assistant is around 2190€ – 2550€ depending on completed study credits.  

We offer a wide range of staff benefits, such as occupational health care services, flexible working hours, versatile research infrastructure, modern teaching facilities, excellent sports facilities on campus and several restaurants and cafés on campus with staff discounts. Please read more about working at Tampere University  and Working in Tampere, Finland.  

ABB is a global technology leader in electrification and automation, enabling a more sustainable and resource‑efficient future. By combining its expertise in engineering and digitalization, ABB helps various industrial sectors operate at high performance while increasing their efficiency, productivity, and sustainability, enabling them to succeed better. 

In Finland, ABB employs approximately 5,500 professionals and operates in about 20 locations, serving the entire country. The main manufacturing hubs are located in Helsinki, Vaasa, Porvoo, and Hamina.

• Helsinki, Pitäjänmäki: motors, generators, drives, robots, CPM energy management systems and paper machine drive solutions, global ABB Ability™ platform development, and Motion Services
• Helsinki Vuosaari, Hamina: Azipod® propulsion systems
• Vaasa: motors, low-voltage products and systems, power transmission and distribution systems, power generation systems, turnkey projects for process industries, Electrification Service
• Porvoo: electrical installation products

Requirements 

We do not expect previous research experience but appreciate enthusiasm to work hard and learn more. 

Minimum formal requirements is a study right in a university in Tampere University. We value both practical skills in addition to good study records, or in another well-established university, and ability and high motivation for working with us in one or more of the aforementioned areas. We require capability to communicate in English. 

Tampere University is a unique, multidisciplinary, and boldly forward-looking community. Our values are openness, diversity, responsibility, courage, critical thinking, and learner-centeredness. We hope that you can embrace these values and promote them in your work. 

How to apply 

Please submit your application through our online recruitment system. The closing date for applications is the 20th of February 2026 (23:59 EET / UTC +2).  Applications and all accompanying documentation should be written in English, and in PDF format only.  

Please note that applicants may be invited to participate in an interview throughout the application period and therefore we encourage you to apply as soon as possible. 

Please attach only the following documents to your application:  

• Curriculum Vitae  
• Transcript of studies 
• Cover-letter underlying your current skills, main interests and what you want to learn during the thesis project
• Link to public Git-repo if you have any

For more information, please contact:  

Associate Professor Jukka Viheriälä, jukka.viheriala@tuni.fi 

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Tampereen yliopisto ja Tampereen ammattikorkeakoulu muodostavat yhdessä Suomen toiseksi suurimman monitieteisen, innostavan ja vaikuttavan tutkimus- ja oppimisyhteisön. Korkeakouluyhteisömme osaamiskärjet ovat tekniikka, terveys ja yhteiskunta. Lue lisää: www.tuni.fi

Tampereen yliopiston Edistyneiden elektroniikan pakkausteknologioiden -tutkimusryhmä hakee kokoaikaista tutkimusapulaisia noin kuuden kuukauden määräaikaiseen työsuhteeseen. 

Lue tarkemmat tiedot tehtävästä ja hakuohjeet yllä olevasta englanninkielisestä ilmoituksesta. 

Jätäthän hakemuksesi yliopiston sähköisellä hakulomakkeella (linkki löytyy tämän ilmoituksen alta).  

Hakuaika tehtävään päättyy 20.2.2026 klo 23.59.

Osaamisalue: Tutkimus, kehitys & tuotekehitys