{"id":3815997,"date":"2026-06-30T13:00:00","date_gmt":"2026-06-30T10:00:00","guid":{"rendered":""},"modified":"2026-06-30T13:00:19","modified_gmt":"2026-06-30T10:00:19","slug":"3815997","status":"publish","type":"job_listing","link":"https:\/\/laura.fi\/en\/vacancies\/tampereen-yliopisto\/design-simulation-and-modelling-engineer-for-advanced-semiconductor-packaging-sipfab-mallinnus-insinoori-sipfab\/3815997\/","title":{"rendered":"Design, Simulation and Modelling Engineer for Advanced Semiconductor Packaging (SiPFAB) \/ Mallinnus-insin\u00f6\u00f6ri (SiPFAB)"},"content":{"rendered":"<p><em>Tampere University and Tampere University of Applied Sciences create a unique environment for multidisciplinary, inspirational and high-impact research and education. Our universities community has its competitive edge in technology, health and society. <a href=\"http:\/\/www.tuni.fi\/en\" target=\"_blank\">www.tuni.fi\/en<\/a>\u00a0<\/em><\/p>\n<p><strong>Tampere University System-in-Package Fabrication (SiPFAB) is now looking for a\u00a0<\/strong><strong>Simulation Engineer.\u00a0<\/strong><\/p>\n<p><a href=\"https:\/\/www.tuni.fi\/en\/research\/system-package-pilot-line-sipfab\" target=\"_blank\">System-in-Package Fabrication (SiPFAB<\/a>) is a new infrastructure being established at the <a href=\"https:\/\/www.tuni.fi\/en\/about-us\/faculty-information-technology-and-communication-sciences\" target=\"_blank\">Faculty of Information Technology and Communication Sciences (ITC)<\/a> of Tampere University. Located on the Hervanta campus, SiPFAB focuses on chip packaging, integration, and testing. The pilot line provides a unique environment for combining and testing Wide Bandgap (WBG) chips and various semiconductor components as complete system solutions.\u00a0<\/p>\n<p>SiPFAB enables the development and experimentation of future-oriented, environmentally friendly, and customized packaged chip systems. The infrastructure supports research and pilot-scale development of emerging chip technologies that drive energy-efficient solutions for industrial applications in transportation and energy systems. SiPFAB offers research and development services, piloting opportunities, and expert support across all stages of chip integration and packaging for the industry\u2014 from concept to prototype and pre-production.\u00a0<\/p>\n<p>SiPFAB is part of the <a href=\"https:\/\/www.chips-ju.europa.eu\/Project-detail\/?id=97b6afc8-761c-f111-8341-7ced8d10ebdf\" target=\"_blank\">Chips\u00a0JU Wide Band Gap Pilot Line<\/a>, which contributes to the European objective of strengthening the semiconductor technology and manufacturing ecosystem. \u00a0<\/p>\n<p><strong>WBG Pilot Line infrastructures\u00a0<\/strong><\/p>\n<p>The national nodes of the WBG Pilot line will host different cleanroom facilities enabling the transition from research to industrial-scale production in the WBG and Ultra-WBG semiconductor technologies, consolidating Europe&#039;s autonomy in the semiconductor sector.<br \/><a href=\"https:\/\/www.wbg-pilot-line.eu\/\" target=\"_blank\">Read more about the WBG Pilot Line<\/a>\u00a0<\/p>\n<p><\/p>\n<p><strong>JOB DESCRIPTION\u00a0<\/strong><\/p>\n<p>SiPFAB is looking for an experienced Design, Simulation and Modelling Engineer. As a Simulation Engineer specializing in the modelling and simulation of power and RF semiconductor packaging, you will lead the development of SiPFAB\u2019s design, modelling and simulation processes and methods. Working as part of a multidisciplinary team, you will contribute directly to customer projects spanning academia, research institutes, and industry driving the demonstration, maturation, and commercialization of advanced packaging technologies.\u00a0<\/p>\n<p>In this role, you will also play a key part in defining software tools used at SiPFAB, exploring novel AI driven design and simulation methodologies and have the freedom to explore novel solutions for semiconductor packaging applications ensuring a robust and scalable design process for SiPFAB.\u00a0<\/p>\n<p><strong>Your Key Responsibilities\u00a0<\/strong><\/p>\n<ul>\n<li>\n<p>Establishing, developing, and\u00a0optimizing\u00a0design,\u00a0simulation\u00a0and\u00a0modelling processes for\u00a0semiconductor\u00a0packaging\u00a0applications\u00a0<\/p>\n<\/li>\n<li>\n<p>Actively contributing to ongoing and future R&amp;D and customer projects\u00a0<\/p>\n<\/li>\n<li>\n<p>Engaging and collaborating with academic, RTO, and industrial partners\u00a0<\/p>\n<\/li>\n<li>\n<p>Establishing\u00a0Assembly\u00a0Design\u00a0Kits\u00a0<\/p>\n<\/li>\n<li>\n<p>Create,\u00a0modify, and verify mask layouts for semiconductor packaging processes using industry-standard CAD\/layout tools\u00a0<\/p>\n<\/li>\n<li>\n<p>Selecting, specifying, and\u00a0procuring\u00a0software\u00a0tools\u00a0<\/p>\n<\/li>\n<li>\n<p>Exploring and developing the use\u00a0of\u00a0AI\u00a0in semiconductor packaging simulation and design\u00a0<\/p>\n<\/li>\n<li>\n<p>Upkeep of software\u00a0tooling\u00a0<\/p>\n<\/li>\n<li>\n<p>Working closely with\u00a0software\u00a0vendors to advance\u00a0simulation and design\u00a0capability\u00a0<\/p>\n<\/li>\n<li>\n<p>Training of new users\u00a0<\/p>\n<\/li>\n<\/ul>\n<p><\/p>\n<p><strong>REQUIREMENTS\u00a0<\/strong><\/p>\n<p>You are a proactive engineer who enjoys problem solving and working with different stakeholders.\u00a0<\/p>\n<p>Required Skills &amp; Experience\u00a0<\/p>\n<ul>\n<li>\n<p>M.Sc. or Ph.D. in an applicable field such as Electrical or Process Engineering, Physics, Materials Science or Semiconductor Packaging Technology\u00a0<\/p>\n<\/li>\n<li>\n<p>At least 5 years of relevant work experience\u00a0<\/p>\n<\/li>\n<li>\n<p>Proven experience in semiconductor simulation, modelling and\/or design\u00a0<\/p>\n<\/li>\n<li>\n<p>A strong, structured approach to problem solving and troubleshooting\u00a0<\/p>\n<\/li>\n<li>\n<p>Ability to work effectively in conditions of ambiguity where processes and tools are still evolving\u00a0<\/p>\n<\/li>\n<li>\n<p>A team player with strong communication and collaboration skills \u00a0<\/p>\n<\/li>\n<li>\n<p>High attention to detail and process discipline\u00a0<\/p>\n<\/li>\n<li>\n<p>Fluent spoken and written skills in English \u00a0<\/p>\n<\/li>\n<\/ul>\n<p><strong>Considered as an asset\u00a0<\/strong><\/p>\n<ul>\n<li>\n<p>Experience in the semiconductor or microelectronics industry\u00a0<\/p>\n<\/li>\n<li>\n<p>Background in pilot-line environments or lab-to-production transitions\u00a0<\/p>\n<\/li>\n<li>\n<p>Interest in following and understanding trends in the semiconductor packaging industry\u00a0<\/p>\n<\/li>\n<li>\n<p>Knowledge of the Finnish language \u00a0<\/p>\n<\/li>\n<\/ul>\n<p>Tampere University is a unique, multidisciplinary and boldly forward-looking, evolving community. Our values are openness, diversity, responsibility, courage, critical thinking, erudition, and learner-centeredness. We expect you to embrace these values and promote them in your work. \u00a0 \u00a0\u00a0<\/p>\n<p><\/p>\n<p><strong>WE OFFER\u00a0<\/strong><\/p>\n<p>At SiPFAB, you will be working at the forefront of European semiconductor development and manufacturing initiatives. We offer a high-autonomy environment designed for proactive, self-driven engineers and opportunities for substantial impact and visibility within both the organization and wider ecosystem. In addition, we offer direct collaboration with researchers, industry partners, and the semiconductor community. This is a key role in shaping and demonstrating breakthrough packaging technologies. \u00a0<\/p>\n<p>At SiPFAB, you will get enthusiastic and awesome colleagues to work with. As a member of staff at Tampere University, you will enjoy a range of competitive benefits, such as a flexible work schedule, good facilities for teleworking, occupational healthcare services, a variety of affordable food and drink outlets across our campuses and a personal fund to spend on sports and cultural activities in your free time. Please read more about <a href=\"https:\/\/www.tuni.fi\/en\/about-us\/working-at-tampere-universities\" target=\"_blank\">working at Tampere University<\/a>. You can also find more information about us and working and living Tampere by watching our video: <a href=\"https:\/\/www.youtube.com\/watch?v=MIlD8H-NFhE\" target=\"_blank\">Tampere Higher Education Community &#8211; our academic playground<\/a>\u00a0<\/p>\n<p>The positions will be filled on permanent basis, commencing preferably as soon as possible mutually agreed. A trial period of six months applies to all our new employees. \u00a0 \u00a0\u00a0<\/p>\n<p>The salary will be based on both the job requirements and the employee&#039;s personal performance in accordance with <a href=\"https:\/\/www.sivista.fi\/wp-content\/uploads\/2025\/05\/YPJ-ja-harkkarien_Palkkataulukot_010725_010626_010627.pdf\" target=\"_blank\">the Finnish Unversity Salary System<\/a> (current new salary tables only available in Finnish). The official job title for the selected candidate will be Specialist. The position of Specialist is placed at requirement levels 8-10 in the salary system (Other Expert and Support Staff).\u00a0<\/p>\n<p><strong>HOW TO APPLY\u00a0<\/strong><\/p>\n<p>The appointment decision is contingent on the completion of the security clearance vetting procedure to ensure the employee\u2019s integrity and reliability. With the appointee\u2019s consent, Finnish Security and Intelligence Services will conduct a security clearance vetting in accordance with the Security Clearance Act (726\/2014). More information on the security vetting procedure and the rights of people being vetted is available on the website of <a href=\"https:\/\/eur04.safelinks.protection.outlook.com\/?url=https%3A%2F%2Fsupo.fi%2Fetusivu&amp;data=05%7C02%7Cninni.jarvinen%40tuni.fi%7C0896902268d745e8d01208dec078531d%7Cfa6944afcc7c4cd89154c01132798910%7C0%7C0%7C639159820205519846%7CUnknown%7CTWFpbGZsb3d8eyJFbXB0eU1hcGkiOnRydWUsIlYiOiIwLjAuMDAwMCIsIlAiOiJXaW4zMiIsIkFOIjoiTWFpbCIsIldUIjoyfQ%3D%3D%7C0%7C%7C%7C&amp;sdata=AZNmlPeHo0Wj3sYskyj00Zg9t7nkFiHeQb0u83qFBjU%3D&amp;reserved=0\" target=\"_blank\">Finnish Security and Intelligence Service<\/a>.\u00a0<\/p>\n<p>\u00a0<\/p>\n<p>Please submit your application through our online recruitment system (link below). The closing date for applications is <strong>3.8.2026 at 23:59 (Finnish time EEST \/ UTC +3)<\/strong>. Applications and all accompanying documentation must be in English.\u00a0<\/p>\n<p>The following documents should accompany your application:\u00a0<\/p>\n<ul>\n<li>\n<p>a CV (with a list of publications if applicable)\u00a0<\/p>\n<\/li>\n<li>\n<p>a free-form application letter (max. 1 page)\u00a0<\/p>\n<\/li>\n<li>\n<p>copies of degree certificates\u00a0<\/p>\n<\/li>\n<li>\n<p>names and contact details of two professional references with your application\u00a0<\/p>\n<\/li>\n<\/ul>\n<p><\/p>\n<p><strong>MORE INFORMATION \u00a0<\/strong><\/p>\n<p>Head of SiPFAB infrastructure Ville Saunajoki, ville.saunajoki@tuni.fi, +358400314928 \u00a0<\/p>\n<p>Director of SiPFAB Tuomas Lahtinen, tuomas.lahtinen@tuni.fi, +358503232287\u00a0<\/p>\n<p>\u00a0<\/p>\n<p>*******************************************\u00a0<\/p>\n<p><em>Tampereen yliopisto ja Tampereen ammattikorkeakoulu muodostavat yhdess\u00e4 Suomen toiseksi suurimman monitieteisen, innostavan ja vaikuttavan tutkimus- ja oppimisyhteis\u00f6n. Korkeakouluyhteis\u00f6mme osaamisk\u00e4rjet ovat tekniikka, terveys ja yhteiskunta. Lue lis\u00e4\u00e4: www.tuni.fi\u00a0<\/em><\/p>\n<p>Haemme nyt mallinnusinsin\u00f6\u00f6ri\u00e4 <a href=\"https:\/\/www.tuni.fi\/fi\/tutkimus\/system-package-pilotointilinja-sipfab\" target=\"_blank\">Sirujen paketoinnin ja integroinnin pilottilinjaan (SiPFABiin),<\/a> joka sijoittuu Tampereen yliopiston <a href=\"https:\/\/www.tuni.fi\/fi\/tutustu-meihin\/informaatioteknologian-ja-viestinnan-tiedekunta\" target=\"_blank\">Informaatioteknologian ja viestinn\u00e4n tiedekuntaan (ITC).<\/a> \u00a0<\/p>\n<p><strong>HAKUOHJEET<\/strong>\u00a0<\/p>\n<p>Valintap\u00e4\u00e4t\u00f6s edellytt\u00e4\u00e4 henkil\u00f6turvallisuusselvityst\u00e4 ty\u00f6ntekij\u00e4n luotettavuuden varmistamiseksi. Suojelupoliisi tekee henkil\u00f6turvallisuusselvityksen valittavan suostumuksella turvallisuusselvityslain (726\/2014) mukaisesti my\u00f6hemmin erikseen. Lis\u00e4tietoa turvallisuusselvitysmenettelyst\u00e4 ja selvityksen kohteen oikeuksista: <a href=\"https:\/\/eur04.safelinks.protection.outlook.com\/?url=https%3A%2F%2Fwww.supo.fi%2F&amp;data=05%7C02%7Cninni.jarvinen%40tuni.fi%7C0896902268d745e8d01208dec078531d%7Cfa6944afcc7c4cd89154c01132798910%7C0%7C0%7C639159820205553729%7CUnknown%7CTWFpbGZsb3d8eyJFbXB0eU1hcGkiOnRydWUsIlYiOiIwLjAuMDAwMCIsIlAiOiJXaW4zMiIsIkFOIjoiTWFpbCIsIldUIjoyfQ%3D%3D%7C0%7C%7C%7C&amp;sdata=PtuhiPiXPa78qp%2BnMVEXiTkPd3zKuXSR4KepEakP4KQ%3D&amp;reserved=0\" target=\"_blank\">www.supo.fi<\/a>\u00a0<\/p>\n<p>Lue tarkemmat tiedot teht\u00e4v\u00e4st\u00e4 ja hakuohjeet yll\u00e4 olevasta englanninkielisest\u00e4 ilmoituksesta.\u00a0<\/p>\n<p>J\u00e4t\u00e4th\u00e4n hakemuksesi yliopiston s\u00e4hk\u00f6isell\u00e4 hakulomakkeella (linkki l\u00f6ytyy t\u00e4m\u00e4n ilmoituksen alta). <strong>Hakuaika teht\u00e4v\u00e4\u00e4n p\u00e4\u00e4ttyy 3.8.2026 klo 23:59.<\/strong><\/p>\n","protected":false},"author":119569,"featured_media":0,"template":"","meta":{"_acf_changed":false,"inline_featured_image":false,"_company_tagline":"","_company_website":"","_company_twitter":"","_company_video":"","_filled":0,"_featured":0,"_remote_position":0,"_job_salary":"","_job_salary_currency":"","_job_salary_unit":""},"job_listing_region":[37],"job-categories":[1524,14682,14674,1658,1357],"job-types":[1101],"job_listing_tag":[1169],"class_list":{"0":"post-3815997","1":"job_listing","2":"type-job_listing","3":"status-publish","4":"hentry","5":"job_listing_region-pirkanmaa","11":"job_listing_type-permanent","12":"job_listing_tag-research-development-rd","16":"job_listing_company-tampereen-yliopisto","17":"worktime-full-time","19":"job-type-permanent"},"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v26.1.1 - 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